收藏本站
NXP Semiconductors
temperature
IP4350CX24
9-channel SD memory card interface ESD protection ?lter
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature pro?les for large and small components
For further information on temperature pro?les, refer to application note AN10365
“Surface mount re?ow soldering description”.
10.3.1 Stand off
The stand off between the substrate and the chip is determined by:
? The amount of printed solder on the substrate
? The size of the solder land on the substrate
? The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coef?cient) differences between substrate and chip.
10.3.2 Quality of solder joint
A ?ip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after re?ow can occur during the re?ow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after re?ow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
10.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
IP4350CX24_1
? NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 5 February 2010
12 of 16
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
IP4352CX24/LF,135 DIODE ARRAY ESD PROT 9CH WLCSP24
IP4358CX6,135 IC ESD PROTECTION
IP4387CX4/P,315 IC ESD PROTECTION WLCSP
IP4790CZ38/1,118 IC ESD PROTECTION VIDEO 38TSSOP
IPC3SAD7/1L0G SWITCH PUSH SPST-NO 0.5A 48V
IPR1SAD2L0G SWITCH PUSHBUTTON SPST 2A 125V
IPS-3901 BOX ALUM 3.79X3.79X1.77 NAT
IPS-3903 BOX ALUM 3.79X3.79X2.64 NAT
相关代理商/技术参数
IP4352CX24 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4
IP4352CX24/LF 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4
IP4352CX24/LF,135 功能描述:ESD 抑制器 9CH SD MEMORY CARD RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
IP4353CX15/LF 制造商:NXP Semiconductors 功能描述:Cut Tape
IP4353CX15/LF,135 功能描述:ESD 抑制器 6-CH CRC-type EMI filter/ESD protect RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
IP4355CX6/LF 制造商:NXP Semiconductors 功能描述:
IP4355CX6/LF,135 功能描述:ESD 抑制器 Audio pathEMI Filter ESD protect devices RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C
IP4355CX6/P,135 制造商:NXP Semiconductors 功能描述:- Tape and Reel